摘要：MPC5510KIT是支持飛思卡爾MPC5510微控制器的評(píng)估系統(tǒng)。它包含一個(gè)評(píng)估板MPC5510EVB和子卡，采用144LQFP或208MAPBGA封裝，插入到評(píng)估板上。 該評(píng)估系統(tǒng)允許調(diào)試通過(guò)Nexus連接器完全訪問(wèn)MCU。
Keywords：body electronics，variable length encoding， MPC5510
基本特性：
Designed for body electronics, the Qorivva MPC5510 belongs to an expanding family of automotive-focused products that address the next wave of central body and gateway applications within the vehicle. Freescale’s advanced cost-efficient Qorivva MPC5510 automotive controller family is built on Power Architecture® technology. It operates at speeds of up to 80 MHz with two e200z cores offering high-performance processing and flexibility while continuing to meet low-power requirements.
Product Benefits：
Enables centralized architectures, which reduce the number of distributed electronic control units (ECU) and complexity of vehicle architectures
Connects FlexRay™ nodes to the body electronics domain
Exceeds 100 Dhrystone MIPS (DMIPS) performance
Minimizes ECU leakages below 200 µA, depending on functionality
Provides extensive communication capabilities including FlexRay, multiple CAN and LIN support
Offers room to grow with scalable family ranging from 512 KB up to 1.5 MB of embedded flash
Leverages Power Architecture network for third-party tools and software
Features
Power Architecture e200z1 core with variable length encoding (VLE)
Optional VLE-only 32/16-bit e200z0 secondary core
16-channel eDMA (enhanced direct memory access)
Memory management unit (MMU) with 4-entry translation look-aside buffer (TLB)
Multiple low-power modes
JTAG and Nexus class 2+ debug support
Up to 1.5 MB of flash with error correction coding (ECC)
The flash module features read while write (RWW) and small partitions for optimal bootloader and EEPROM emulation support
Up to 80 KB of SRAM with ECC
Memory protection unit (MPU) with up to 16 regions and 32B granularity
This product is included in Freescale’s product longevity program, with assured supply for a minimum of 15 years after launch
方案描述：
The EVB is intended to provide a mechanism for easy customer evaluation of the MPC5510 family of microprocessors, and to facilitate hardware and software development.
There are currently 3 package types supported within the MPC5510 family (and by the EVB), namely 208BGA, 176QFP and 144QFP.
For maximum flexibility and simplicity, the EVB has been designed as a modular development platform. The EVB main board does not contain an MCU. Instead, the MCU is fitted to an MCU daughter card (sometimes referred to as an adapter board). This approach means that the same EVB platform can be used for multiple package and MCU derivatives within the MPC5510 family. High density connectors provide the interface between the EVB and MCU daughter cards as shown in the diagram below. See section 4 for more information on the daughter card configuration.
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